The ESD packaging market in North America, especially the United States, is expected to approach around the billion dollar mark
JUMEIRAH LAKES TOWERS, DUBAI, UNITED ARAB EMIRATES, December 15, 2021 /EINPresswire.com/ – The Electrostatic Discharge (ESD) packaging market is expected to grow at a moderate CAGR throughout the forecast period (2020-2030). The increasing adoption of ESD packaging in the automotive industry is expected to fuel the market growth during the forecast period.
Suppliers rely on the customization of the product offering to meet multiple sectors, thereby improving their future income prospects, ”comments the IMF analyst.
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The deepening internet penetration has accelerated the adoption of various electronic and IoT devices to streamline production and operational efficiency. As a result, the production of integrated circuit boards, chips and other materials has increased, offering immense potential for expansion of electrostatic discharge packaging solutions.
Prolific developments are expected in the automotive manufacturing segment as companies seek to take advantage of automation and cloud computing systems to generate greater production. However, the near-term outlook appears bleak in the wake of the COVID-19 pandemic.
Electrostatic Discharge Packaging Market – Highlights
North America is expected to reach US $ 1 billion, while China will become the fastest growing country for the ESD packaging market.
The auto industry will remain very lucrative throughout the forecast period
Customized packaging solutions represent a higher revenue share compared to the ready-to-use portfolio.
Mergers and acquisitions remain the key strategies of market players
Electrostatic Discharge Packaging Market – Driving Factors
ESD packaging is used to transport consumer electronics as well as large servers and computers.
Adoption of advanced computer system is fueling demand for ESD packaging.
The manufacture of circuit boards, displays and semiconductors requires ESD packaging to reduce any static electricity.
Electronic and electrical components such as laptops, smartphones, tablets, etc. have experienced constant demand due to the remote working arrangements.
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Electrostatic Discharge Packaging Market – Main Constraints
The presence of metallic powder in the product can damage stored devices, thus limiting adoption.
The shortage of skilled labor is to a large extent hamper the growth of the market.
Expected impact on the market by coronavirus epidemic
The pandemic has had varying impacts on the growth prospects of ESD packaging in end-use industries. Growth has been maintained due to the regulation of working from home, but the automotive and manufacturing industries have experienced declines in the past.
According to research analysts, the United States will experience a better CAGR throughout the assessment period and return to its pre-pandemic position much sooner. Due to the high likelihood of a second wave of coronavirus in Europe, demand will remain sluggish in the region.
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Leading manufacturers incorporate innovative techniques such as product expansion and custom packaging solutions. The main players in the market are Conductive Containers Inc., Tandem Equipment Sales Inc., Elcom (UK) Ltd., Global STATCLEAN SYSTEMS and NEFAB Group. Sellers capitalize on mergers and acquisitions to deal with an ever-changing market scenario.
For example, Conductive Containers Inc. has designed nearly 85% of custom designs ranging from custom bins to shippers to remain perfectly suited for ESD applications.
The NEFAB group focuses on the “green strategy” and reduces harmful environmental impacts. Due to the minimized cost and impact, this company has grown into a leading provider of packaging solutions in segments such as telecommunications, aerospace, vehicles and healthcare.
Elcom Limited is another major player in the ESD packaging solutions market. This company focuses on classroom training and enables customers to test and audit new products while also focusing on world-class development needs that meet industrial and manufacturing needs.
More on the report
The IMF report provides market analysis of key trends and macroeconomic factors on the basis of material (metal, additive, conductive polymer), product type (bag, trays, bins, boxes, shells), l ‘application (semiconductor, screen, therapeutics and diagnostic equipment, etc.) and segmentation by region (North America, Asia-Pacific, Eastern and Western Europe, Oceania).
1.1. Global Market Outlook
1.2. Market analysis
1.3. Analysis and recommendations
2. Market overview
2.1. Market coverage
2.2. Market definition
3. Key market trends
3.1. Key trends impacting the market
3.2. Product innovation trends
4. Key success factors
4.1. Product adoption analysis
4.2. USP Products / Features
5. Global ESD Packaging Market Demand Analysis 2015-2019 and Forecast, 2020-2030
5.1. Historical Market Volume Analysis (Tons), 2015-2019
5.2. Current and future projections of market volume (tonnes), 2020-2030
5.3. Year-over-year growth trend analysis
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